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#chiplet

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Alo Japan

alojapan.com/1230376/rapidus-s Rapidus Signs Comprehensive Collaboration Agreement with Hokkaido UniversityGoal is to enhance Japan’s scientific and technological capabilities, and develop human resources for the semiconductor industry – Information #2nm #AI. #Chiplet #Chitose #DMCO #EUV #Foundry #GAA #green #Hokkaido #HokkaidoTopics #IIM #LogicSemiconductors #NextGeneration #Raads #rapidus #RUMS #semiconductors #北海道 UPDATE: 2024.06.05 Information June 5, 2024 – Rapi…

Rapidus Signs Comprehensive Collaboration Agreement with Hokkaido UniversityGoal is to enhance Japan’s scientific and technological capabilities, and develop human resources for the semiconductor industry - Information
Public
Alo Japan

alojapan.com/1229433/rapidus-b Rapidus begins installation of Japan’s first NXE:3800E EUV lithography machinery for semiconductor mass production – Information #2nm #AI. #Chiplet #Chitose #DMCO #EUV #Foundry #GAA #green #Hokkaido #HokkaidoNews #IIM #LogicSemiconductors #news #NextGeneration #Raads #rapidus #RUMS #semiconductors #北海道 UPDATE: 2024.12.18 Information HOKKAIDO, Japan, Dec. 18, 2024 —Rapidus Corporation, a manufacturer of advanced logic semiconductors, tod…

Commemorative photo at the ceremony, from left to right; Mr. Naohiko Yokoshima (President, NEDO); Mr. Toshikazu Okuya (Deputy Director-General, Commerce and Information Policy Bureau, METI); Mr. Naomichi Suzuki (Governor of Hokkaido); Dr. Atsuyoshi Koike (CEO, Rapidus); Mr. Jim Koonmen (EVP/CCO, ASML); H.E. Mr. Gilles Beschoor Plug (Ambassador of the Kingdom of Netherlands to Japan); Mr. Ryuichi Yokota (Mayor of Chitose City)
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Fraunhofer-Gesellschaft

Die #Chiplet-Technologie ist eine der größten Innovationen der Elektronikbranche und ermöglicht modulares, flexibles #Chipdesign. Chiplet-basierte Systeme bieten hohe Leistung und geringen Stromverbrauch. Das Fraunhofer IIS entwickelt wettbewerbsfähige Lösungen auf System-, Komponenten- und Transistorebene, mit Fokus auf neue Architekturen und effiziente Schnittstellen. Besuche uns bis 15. November 2024 auf der #electronica in München, Halle B4, Stand 141. Mehr dazu: s.fhg.de/698

Public
oiger

Um Europas Mikroelektronik einen kräftigen Technologieschub zu verschaffen, planen Fraunhofer, Imec und Leti eine paneuropäische Pilotlinie. Ein deutsche Kofinanzierung zeichnet sich laut Fraunhofer Dresden nun doch ab:
oiger.de/2024/01/22/hoffnungss
#Paneuropäisch #Pilotlinie #Plattform #Mikroelektronik #Fraunhofer #Imec #Leti #Chiplet #Nanometer #Technologie #Subvention #Beihilfe #Chipgesetz #ECA #Investition #Innovation #IPMS #CNT #Assid #Enas #Ampel #Haushaltskrise #Finanzierung #Bund #Sachsen

Oiger · Hoffnungssignale für paneuropäische Chip-Pilotlinie - OigerFraunhofer, Imec und Leti planen eine paneuropäische Mikroelektronik-Pilotlinie. Bundeszuschüsse zeichnen sich laut IPMS Dresden nun doch ab,
Public
Benjamin Carr, Ph.D. 👨🏻‍💻🧬

#RISCV #Chiplet #CPU With 432 Cores To Handle #AI & #HPC Workloads In #Space
The newly formed project group called the Parallel Ultra Low Power Platform has developed an #opensource RISC-V silicon AI chip with tape-outs called Occamy. Occamy will be capable of performing high-performance calculations, increasing efficiency while lowering the time it would take to make these calculations previously.
wccftech.com/risc-v-chiplet-cp #ESA

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